Chipset: SREII H-Series
Architecture: 64-bit
Number of Cores: Hexa-core
Clock Speed: Up to 2.4 GHz
Cache: L1: 384 KB, L2: 1.5 MB, L3: 8 MB
Instruction Set: ARMv8
Graphics Processing Unit (GPU): Integrated Mali-G76 MP6
Memory Support: LPDDR4X, up to 3200 MHz
Connectivity:
- Wi-Fi 6
- Bluetooth 5.1
- USB 3.2 Gen 1
- PCIe 3.0
Process Technology: 7nm
Power Consumption: - Active: 5W
- Idle: 0.5W
Operating Temperature: -20°C to 85°C
Package Size: 12 mm x 12 mm
Package Type: BGA (Ball Grid Array)